Last week, it was revealed that Samsung will unveil the world’s first 3nm chips on July 25. Today, the South Korean firm held a ceremony for the first shipment of its 3nm GAA chips. The ceremony was held at the company’s V1 line at Hwaseong Campus in Gyeonggi-do province in South Korea.

The event was attended by around 100 people, including Changyang Lee (Minister of Trade, Industry, and Energy), Kye Kyung-hyeon (CEO of Samsung Electronics DS), and all the important employees who participated in the development and mass production of 3nm GAA chips. During the event, Samsung expressed its ambitions to “go forward with innovative technology to become the best in the world.

Samsung Foundry Vice President Jeong Ki-tae said that technological hurdles in developing 3nm chips were solved through collaboration beyond the company. The company worked with Samsung’s other business arms and global manufacturing and infrastructure partners.

Samsung’s 3nm chips use the GAA (Gate All Around) technology for higher power efficiency and faster performance than the existing FinFET technology. This technology will be used to make high-performance computing chips for servers and data centers. It will also be used to make high-end chips for smartphones, tablets, wearable devices, laptops, PCs, and more.

The South Korean firm started the development of GAA technology in the early 2000s and successfully applied it to 3nm chips in 2017. After a few years of research and development, the company started the trial production run of its new chips. These chips are being supplied to a Chinese cryptocurrency mining firm.

TSMC, Samsung’s primary rival firm in the semiconductor contract manufacturing space, is expected to make 3nm chips sometime in Q4 2022. Both firms will fight to get orders from big clients like AMD, Apple, MediaTek, Nvidia, and Qualcomm.

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